The Imaging Process
   

In order to view objects with the SEM, the objects must be plated with a conductive surface (often Au or Graphite). Here, a sputtering machine is used to deposit gold-palladium on the surface. Once coated, the gold surface cannot be removed by abrasion or gold flakes form and collect into the holes as seen in the picture below. It was shown that the material in the hole is gold by using x-ray analysis. Cleaning in a sonicating bath successfully removes the gold flakes.

 

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The SEM uses a beam of 15 KeV electrons. This causes the surface to be damaged. This can be seen immediately, and is amplified by etching as seen in the pictures below. The depth of the damaged squares is smaller than the hole depths, but prohibits repeated imaging and etching. A lower energy beam can be used but this yields poorer image quality.

 
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